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Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Marchio: rmi
Numero di modello: X-7900
MOQ: 1
prezzo: US$ 23000
Dettagli dell' imballaggio: Scatola di Wodden
Condizioni di pagamento: T/T
Informazione dettagliata
Luogo di origine:
Guangdong, Cina
Certificazione:
CE
peso:
1050KG
Voltaggio:
AC110-220V 50-60Hz
Risoluzione spaziale:
μm 3
Tensione del tubo:
130kV
Corrente del tubo:
300μA
Precisione dell'immagine:
Digitale a schermo piatto
Densità conversione A/D:
16 bit (65536)
Dpi:
1536*1536px
Frequenza dei fotogrammi:
20 fps
Ingrandimento ottico:
450X
Ingrandimento del sistema:
2000X
Energia:
1200W
Dimensione della macchina:
L1098 x L1389 x A2157 mm
Capacità di alimentazione:
1000 unità / mese
Evidenziare:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

Descrizione di prodotto
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications
  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?
  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes
  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support

Buon prezzo  in linea

Dettagli dei prodotti

Casa > prodotti >
macchinario di produzione di elettronica
>
Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Industrial SMT X-Ray Inspection System Automated PCB X-Ray Counter for BGA Solder Joint & IC Welding Defect Detection

Marchio: rmi
Numero di modello: X-7900
MOQ: 1
prezzo: US$ 23000
Dettagli dell' imballaggio: Scatola di Wodden
Condizioni di pagamento: T/T
Informazione dettagliata
Luogo di origine:
Guangdong, Cina
Marca:
rmi
Certificazione:
CE
Numero di modello:
X-7900
peso:
1050KG
Voltaggio:
AC110-220V 50-60Hz
Risoluzione spaziale:
μm 3
Tensione del tubo:
130kV
Corrente del tubo:
300μA
Precisione dell'immagine:
Digitale a schermo piatto
Densità conversione A/D:
16 bit (65536)
Dpi:
1536*1536px
Frequenza dei fotogrammi:
20 fps
Ingrandimento ottico:
450X
Ingrandimento del sistema:
2000X
Energia:
1200W
Dimensione della macchina:
L1098 x L1389 x A2157 mm
Quantità di ordine minimo:
1
Prezzo:
US$ 23000
Imballaggi particolari:
Scatola di Wodden
Tempi di consegna:
10-15 giorni
Termini di pagamento:
T/T
Capacità di alimentazione:
1000 unità / mese
Evidenziare:

3um Accuracy X-Ray Inspection System

,

2000X Magnification X-Ray Tester

,

PCB BGA Lithium Battery Testing X-Ray Testing Equipment

Descrizione di prodotto
Ultra High Precision X-7900 2000X X-Ray Inspection System SMT X-Ray Inspection Machine

The Industrial SMT X-Ray Inspection System is a high-precision non-destructive testing (NDT) solution designed for modern electronics manufacturing. Ideal for PCB assembly lines, R&D labs, and small-batch production, this system delivers automated detection of hidden defects such as BGA solder joint cracks, IC welding voids, and head-in-pillow failures. Available with 110kV closed tube or 150kV open tube options, and resolution down to 2µm, it ensures zero-defect quality control for automotive, semiconductor, consumer electronics, and medical devices.

Key Features

Advanced Imaging Technology

  • 2µm high-resolution microfocus X-ray tube captures fine details of BGA, QFN, and flip-chip solder joints.

  • Optional 3D CT (computed tomography) inspection provides cross-sectional views for void volume analysis and solder paste quality evaluation.

Flexible Operation Modes

  • Manual mode for R&D and failure analysis.

  • Automated (AXI) mode for high-volume PCB production lines, with programmable inspection paths and auto defect recognition (ADR).

Precision Manipulation

  • 5-axis manipulator (X, Y, Z, tilt, rotation) enables inspection of components from any angle, eliminating blind spots under shields, connectors, and heatsinks.

User-Friendly Software

  • Intuitive interface with BGA void calculation, solder joint measurement, and pass/fail statistics.

  • Data export for SPC (statistical process control) and traceability.

Compact & Benchtop Options

  • Space-saving benchtop design available for laboratories and low-volume assembly.

  • Inline conveyor type for fully automated SMT lines.

Technical Specifications
Model X-7900
Tube Type Enclosed Type
Spatial Resolution 3 μm
Tube Voltage 130kV
Tube Current 300μA
Image Taking Type Flat-panel Digital
Imaging Precision 85μm
A/D Convert Quantified Density Value 16bit (65536)
DPI 1536*1536px
Frame Frequency 20 FPS
Optical Magnification 450X
System Magnification 2000X
Operating System Windows 11
Power Supply AC110-220V 50-60HZ
Power Consumption 1200W
Radiation Safety Test <1 μSV/H
Detector Rotation Angle 60°
Stage Size 540*540mm
Sensing Range 510*510mm
Load-bearing Capacity ≤10kg
Machine Size 1098*1389*2157mm (L*W*H)
Machine Size (Including Monitor) 1601*1920*2157mm (L*W*H)
Machine Weight 1050kg
Stage Movement Automatic / Manual
Applications
  • PCB Assembly: Inspection of BGA, CSP, QFN, LGA, PoP, and through-hole solder joints.

  • Semiconductor: Die attach, wire bonding, and void detection in power modules.

  • Automotive Electronics: Solder quality control for ECUs, LiDAR, and battery management systems.

  • Medical Devices: High-reliability component inspection.

  • R&D & Failure Analysis: Root cause analysis of soldering defects.

Why Choose This SMT X-Ray Tester?
  • Reduce rework costs by catching hidden defects early.

  • Increase throughput with automated inspection routines.

  • Meet industry standards (IPC-A-610, ISO 9001).

  • Global support with CE, FCC, and ROHS certifications.

Package Includes
  • Main X-ray inspection unit

  • Industrial control PC with pre-installed software

  • Calibration tool kit

  • Operation manual and safety guide

  • One-year warranty and remote technical support