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Macchina per la stampa della pasta di saldatura SMT

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

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Contattici

Miss. Alina

alina@hxt-smt.com

+86 16620793861

+86 16620793861

Contatto ora

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Marchio:	HXT
Numero di modello:	DH-5
MOQ:	1 pz
prezzo:	US$ 29000
Dettagli dell' imballaggio:	Scatola di Wodden
Condizioni di pagamento:	T/T

Informazione dettagliata

Descrizione di prodotto

Informazione dettagliata

Luogo di origine:

Guangdong, Cina

Certificazione:

CE, RoHS

Dimensioni del circuito stampato:

Massimo: 50X50m Minimo: 1500X450mm

Pressione del raschiatore:

0,5~0,7Kgf/cm2

Energia:

Dimensione di stampa:

L: 50-550, L: 50-330

Tensione di lavoro:

Fase monofase 220V

Peso:

325 CHILOGRAMMI

Capacità di alimentazione:

1000 unità / mese

Descrizione di prodotto

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

A High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines. It is engineered to deposit solder paste onto PCB pads with micron-level accuracy (typically ±25µm to ±30µm), utilizing high-resolution CCD camera vision systems for precise alignment and closed-loop servo motor control for exceptional repeatability. Unlike entry-level or non-vision printers, this equipment is designed for fine-pitch components (down to 01005, 0.3mm pitch) and high-density PCB assemblies where printing accuracy directly impacts final product yield.

2. Description

Positioned at the very beginning of the SMT production line—immediately after the PCB loader and before the pick-and-place machine—this fully automated printer performs a highly controlled printing process:

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

Stampante automatica della pasta della lega per saldatura

Stampa a schermo con saldatura

macchine per la saldatura

Dettagli dei prodotti

Casa > prodotti >

Macchina per la stampa della pasta di saldatura SMT

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Tutte le categorie

Macchina del posto e della scelta

forno di riflusso

Macchina di SMT AOI

Macchina per la stampa della pasta di saldatura SMT

Macchina SMT SPI

Linea della macchina di SMT

Macchina di inserimento automatico

Macchina per saldatura a onde

Macchina dello scaricatore del caricatore di SMT

trasportatore dello smt

Macchina per la distribuzione della colla

Macchina ricoprente conforme

Macchine per il forno di curaggio

Tagliatrice del PWB

macchinario di produzione di elettronica

Macchine per la produzione di circuiti stampati

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly

Marchio:	HXT
Numero di modello:	DH-5
MOQ:	1 pz
prezzo:	US$ 29000
Dettagli dell' imballaggio:	Scatola di Wodden
Condizioni di pagamento:	T/T

Informazione dettagliata

Descrizione di prodotto

Informazione dettagliata

Luogo di origine:

Guangdong, Cina

Marca:

HXT

Certificazione:

CE, RoHS

Numero di modello:

DH-5

Dimensioni del circuito stampato:

Massimo: 50X50m Minimo: 1500X450mm

Pressione del raschiatore:

0,5~0,7Kgf/cm2

Energia:

500W

Dimensione di stampa:

L: 50-550, L: 50-330

Tensione di lavoro:

Fase monofase 220V

Peso:

325 CHILOGRAMMI

Quantità di ordine minimo:

1 pz

Prezzo:

US$ 29000

Imballaggi particolari:

Scatola di Wodden

Tempi di consegna:

10-15 giorni

Termini di pagamento:

T/T

Capacità di alimentazione:

1000 unità / mese

Descrizione di prodotto

High Precision SMT Automatic Solder Paste Printer is an advanced, fully automated stencil printing machine used in Surface Mount Technology (SMT) assembly lines.

1. Definition

2. Description

Automatic Board Loading & Clamping: PCBs are automatically loaded via conveyor, with top-clamping or side-clamping mechanisms ensuring rigid fixation.
High-Precision Vision Alignment: Dual or single high-resolution CCD cameras capture fiducial marks on both the PCB and the stencil. Advanced pattern recognition algorithms calculate offsets in X, Y, and θ (rotation) axes, automatically adjusting the stencil or PCB table for perfect alignment—often achieving ±25µm alignment accuracy.
Closed-Loop Squeegee Control: Servo-driven squeegee heads apply controlled pressure, speed, and angle across the stencil. Closed-loop feedback systems maintain consistent printing parameters throughout the production run, compensating for paste viscosity changes.
Under-Stencil Cleaning: Integrated automatic cleaning systems (dry, wet, or vacuum) remove residual paste from the stencil underside after each print, preventing bridges and ensuring print quality.
Post-Print Inspection (Optional): Many high-precision models include 2D or 3D post-print inspection capabilities to immediately verify paste volume, height, and area, feeding data back to the printer for real-time process adjustment (closed-loop process control).

The entire process is fully automated, requiring minimal operator intervention, and is managed through an intuitive HMI (Human-Machine Interface) with recipe management for rapid product changeovers.

3. Key Features

Feature Category	Specific Features
Ultra-High Precision Alignment	±25µm to ±30µm printing accuracy; High-resolution CCD vision system (up to 12MP or higher); Automatic fiducial recognition & multi-point alignment
Exceptional Repeatability	Cpk ≥ 1.33 or ≥ 1.67 (industry gold standard); Precision-ground ball screws and linear guides; Temperature-compensated granite or cast-iron base for stability
Advanced Vision System	Top/bottom vision cameras; Automatic stencil mark & PCB fiducial detection; Pattern recognition algorithms; 2D/3D solder paste inspection integration
Closed-Loop Process Control	Real-time squeegee pressure, speed, and position feedback; Automatic paste viscosity compensation; Closed-loop stencil separation (peeling) control for optimal paste release
Automatic Cleaning System	Integrated dry/wet/vacuum under-stencil cleaning; Programmable cleaning frequency; Paperless or roll-type cleaning options
High Throughput	Cycle time typically 5–8 seconds per board (excluding cleaning); High-speed motion control; Rapid changeover (< 5 minutes)
Smart Software & Connectivity	Recipe management with barcode/QR code integration; SPC (Statistical Process Control) data reporting; MES (Manufacturing Execution System) connectivity; Remote monitoring & diagnostics (Industry 4.0 ready)
Robust Mechanical Construction	Heavy-duty cast iron or granite base; Vibration-dampening design; Precision linear guides with high-rigidity squeegee head
User-Friendly HMI	15"–21" touchscreen interface; Intuitive programming wizard; Real-time process monitoring dashboard; Multi-language support
Flexible Board Handling	Supports wide PCB size range (typically 50×50mm up to 600×600mm or larger); Automatic width adjustment; Warped board compensation capability

4. Application

High precision SMT automatic solder paste printers are essential in modern electronics manufacturing where first-pass yield and zero-defect goals are critical:

Consumer Electronics: Smartphones, tablets, laptops, smartwatches—where ultra-fine pitch components (0.3mm–0.4mm pitch) and high-density interconnect (HDI) boards are standard.
Automotive Electronics: ECU (Engine Control Units), ADAS sensors, BMS (Battery Management Systems), infotainment systems—requiring high reliability under harsh conditions.
Telecommunications: 5G base stations, routers, servers—with large, complex PCBs demanding precise paste deposition.
Medical Devices: Implantable devices, diagnostic equipment, monitoring systems—where zero defects are non-negotiable.
Aerospace & Defense: Avionics, radar systems, satellite electronics—requiring the highest levels of quality and traceability.
Industrial Electronics: PLCs, motor drives, power supplies—where long-term reliability is paramount.
Advanced Packaging: SiP (System-in-Package), PoP (Package-on-Package), flip-chip—where paste volume control is extremely sensitive.
High-Mix / High-Volume Production: Any SMT line aiming for Industry 4.0 smart factory integration, with full traceability and data-driven process optimization.

Applications:

For SMT PCB board production assembling full line machines.

Industrial SMT Solder Paste Screen Printer / High Accuracy PCB Stencil Printer for Fine-Pitch PCB Assembly 0

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